DLAP-3000-CFL Serisi
LGA1151 Soketinde 8. / 9. Nesil Intel® Core ™ i7 / i5 / i3 ile MXM Grafik Modülünü destekleyen Gömülü Sistem.
SYSTEM CORE | |
Processor | Intel® Core™ i7-9700TE, 1.8GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® Core™ i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® Core™ i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® Core™ i3-8100T, 3.1GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T) |
Memory | Non-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU) system memory |
Chipset | Intel H310 Chipset |
I/O INTERFACES | |
Display | 6x DisplayPort (2 from CPU, 4 from MXM) |
Ethernet | 1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT) |
Serial Ports | 1x RS-232/422/485, 1x RS-232 |
USB | 4x USB 3.1 Gen1 ports, 4x USB 2.0 ports |
M.2 | 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module |
Digital IO | Default: w/o DIO Option: 1x DI/DO with 4 in, 4 out, one ground pin , and one power pin (no power/5V/12V, 0.5A by BIOS selection) |
Audio | Default: w/o Audio Option 1: Mic-in, Line-out, Line-in Option 2: Mic-in, L/R speaker-out (6W + 6W) Option 3: Line-in, L/R speaker-out (6W + 6W) |
TPM 2.0 | Optional |
eSIM | Optional |
STORAGE | |
SATA | 2x 2.5″ SATA 6Gb/s external drive bays 1x SATA 6Gb/s signal via M.2 B key connector |
MECHANICAL | |
Dimensions | 235 x 182 x 75mm (W x D x H) |
Mounting | Optional wall-mount bracket |
POWER SUPPLY | |
DC Input | DC 12V input (Molex DC-in jack) |
AC Input | Optional: 240W (12V/20A) AC/DC adapter |
ENVIRONMENTAL | |
Operating Temperature | 0°C to 50°C (W/MXM, W/SSD) |
Humidity | 10% to 90%, non-condensing |
Storage Temperature | -20°C to 60°C |
EMC | EN55032/EN55024 |
Safety | UL/cUL, CB, CCC |
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