Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)^‡

2. 16 DIMMs; up to 4TB 3DS ECC
DDR4-2933MHz^† RDIMM/LRDIMM

3. 2 PCI-E 3.0 x16 slots

4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN

5. 4 Hot-swap 2.5″ SATA3 drive bays

6. 2 SuperDOM onboard or optional
2 M.2 carrier

7. Up to 1000W Redundant Power Supplies
Titanium Level (96%)