1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)^‡

2. 12 DIMMs; up to 3TB 3DS ECC
DDR4-2933MHz^† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM^††

3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
1 PCI-E 3.0 x16 (for SIOM )

4. 6 Hot-swap 2.5″ SAS3/SATA3 or 2
Hot-swap 2.5″ SAS3/SATA3 +
4 optional NVMe U.2
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key

5. SAS3 via Broadcom 3108, HW RAID

6. SIOM Network card,
1 dedicated IPMI LAN port

7. 1 VGA, 2 USB 3.0 ports

8. 3x 4cm 20k RPM middle fans

9. 2200W Redundant Power Supplies
Titanium Level (96% Efficiency)