Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)^‡

2. 16 DIMMs; up to 4TB 3DS ECC
DDR4-2933MHz^† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM^††

3. 2 PCI-E 3.0 x16 (LP) slots

4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN

5. 3 Hot-swap 3.5″ SATA3 drive bays

6. Up to 2200W Redundant Power Supplies
Titanium Level (96%)